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Current AffairsScience & Technology

India Semiconductor Mission: Ten Projects, ISM 2.0 and a $150-Billion Roadmap

Thursday, 25 June 20265 min read990 words9

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Science & TechnologyDeep Analysisindia semiconductor missionatmanirbhar bharat manufacturingproduction linked incentive plisupply chain security

In this article

ContextBackgroundKey PointsAnalysisWay Forward

Context

The India Semiconductor Mission (ISM) has emerged as one of the most closely watched industrial-policy bets of the decade. As of December 2025, the government had approved ten semiconductor projects worth about Rs 1.60 lakh crore of cumulative investment across six states, spanning chip-fabrication plants (fabs), compound-semiconductor units and ATMP/OSAT packaging facilities.

The momentum accelerated with two milestones:

  • The Union Budget 2026-27 announced ISM 2.0, a second-generation phase (with a Rs 1,000 crore provision for FY 2026-27) moving the mission from capacity creation to technological depth and global integration.
  • The first packaging facilities went live, including Micron's ATMP plant at Sanand (Gujarat), inaugurated on 28 February 2026, which began commercial production of made-in-India memory modules.

Taken together, these signal India's intent to build a large domestic semiconductor value chain and reduce dependence on a handful of foreign suppliers for the chips that power phones, cars, defence systems and data centres.

Background

What are semiconductors and fabs?

  • A semiconductor (chip) is the silicon-based 'brain' inside every electronic device. Fabs (fabrication plants) etch transistors onto silicon wafers; they are among the most capital-intensive factories on earth.
  • ATMP stands for Assembly, Testing, Marking and Packaging; OSAT means Outsourced Semiconductor Assembly and Test. These are the 'back-end' steps that turn a finished wafer into a usable, packaged chip. They need less cutting-edge technology than fabs, so they are India's natural entry point.

The Semicon India Programme (the foundation):

  • Approved by the Union Cabinet in December 2021 with a financial outlay of Rs 76,000 crore.
  • Administered under the Ministry of Electronics and Information Technology (MeitY), with the India Semiconductor Mission (ISM) as the nodal agency.
  • It offers up to 50% fiscal support on project/capital cost across its scheme set:
  1. Silicon semiconductor fabs
  2. Display fabs (TFT-LCD, AMOLED)
  3. Compound semiconductors, silicon photonics, sensors and ATMP/OSAT
  4. Design Linked Incentive (DLI) scheme for chip design start-ups (product-DLI up to 50% of eligible cost; deployment-linked incentive on net sales)

This structure makes the programme India's semiconductor analogue to the Production Linked Incentive (PLI) model.

Key Points

Approved projects (illustrative):

  • Micron Technology (USA) - ATMP at Sanand, Gujarat; inaugurated 28 February 2026, shipping the first made-in-India memory modules.
  • Tata Electronics + PSMC (Taiwan) - a logic fab at Dholera, Gujarat, on 28nm and mature nodes (automotive, microcontrollers, display drivers); first silicon targeted for late 2026.
  • Tata Semiconductor Assembly & Test - ATMP/OSAT at Jagiroad, Assam.
  • Kaynes Semicon - OSAT at Sanand, reaching commercial production in March 2026.
  • CG Power (with partners) - OSAT at Sanand.
  • HCL-Foxconn JV - OSAT facility near Jewar, Uttar Pradesh (the sixth unit approved under ISM, and UP's first).

ISM 2.0 - the four focus areas (Budget 2026-27):

  1. Indigenous manufacturing of equipment, chemicals, gases and materials
  2. Full-stack design IP development
  3. Research, skills and applied R&D centres
  4. Supply-chain resilience

Targets:

  • A NITI Aayog roadmap urges a USD 120-150 billion value chain by 2035.
  • India's market is projected near USD 100-110 billion by 2030.
  • 70-75% self-sufficiency in domestic chip demand by around 2029.
  • Budget 2026-27 made a dedicated Rs 1,000 crore provision for ISM 2.0, alongside a Rs 8,000 crore outlay for the Modified Programme covering the broader semiconductor and display manufacturing ecosystem.

Analysis

Political & Constitutional

  • Semiconductors are a Union-driven strategic mission, but execution depends on state governments (land, water, power) - Gujarat, Assam and Uttar Pradesh competing to host units reflects cooperative and competitive federalism in industrial policy.

Economic & Financial

  • The up to 50% capital subsidy is unprecedented in scale; it de-risks an industry where a single advanced fab can cost several billion dollars. Risk: fiscal exposure if global chip demand softens or projects under-deliver. ISM 2.0's pivot to materials, IP and design aims to capture higher-value, less capital-hungry segments.

Social Dimensions

  • Each fab/ATMP cluster promises thousands of high-skill jobs and a talent pipeline (the R&D/skills pillar of ISM 2.0). Realising this needs large-scale upskilling in VLSI design, cleanroom operations and materials science.

Governance & Administrative

  • ISM, housed under MeitY, acts as a single-window nodal agency - a model of mission-mode delivery. Speed-to-production (Kaynes reaching output roughly 14 months after groundbreaking) shows administrative streamlining, but sustaining ecosystem-wide coordination is the harder test.

International Perspective

  • The mission is squarely a China-plus-one and supply-chain-security play. The COVID-era chip shortage and US-China tech rivalry (export controls, CHIPS Act) pushed nations to friend-shore chip capacity. India's tie-ups with US (Micron), Taiwan (PSMC) and global majors embed it in trusted supply chains, complementing the Quad and iCET technology partnerships.

Way Forward

  • Move up the value chain: ISM 2.0 must convert back-end ATMP/OSAT strength into front-end fab and design IP capability - the high-margin, high-barrier segments.
  • Secure the inputs: Build domestic capacity in ultra-pure chemicals, gases, photomasks and equipment, where India is import-dependent; pair with water and clean-energy assurance for fabs.
  • Talent at scale: Expand VLSI/chip-design curricula, fund the DLI scheme for start-ups, and retain talent that historically migrated abroad.
  • Diversify geography and partners: Avoid over-concentration in one state; deepen trusted partnerships (US, Taiwan, Japan, EU) for technology transfer.
  • Stay outcome-focused: Track delivered output and self-sufficiency ratios, not just announcements, so the Rs 1.60 lakh crore of commitments translates into a resilient, globally competitive ecosystem by 2035.

What can be asked in exam?

  • •Prelims angle: Semicon India Programme was approved in December 2021 with a financial outlay of Rs 76,000 crore.
  • •Prelims angle: The India Semiconductor Mission (ISM) is the nodal agency, functioning under the Ministry of Electronics and Information Technology (MeitY).
  • •Prelims angle: The programme offers up to 50% fiscal support on project/capital cost for fabs, compound-semiconductor units and ATMP/OSAT facilities.
  • •Mains angle: Examine how the India Semiconductor Mission advances self-reliance and supply-chain security in an era of technology rivalry. (GS-3, 250 words)
  • •Mains angle: ISM 2.0 marks a shift from capacity creation to technological depth. Critically analyse this transition and its challenges. (GS-3, 250 words)

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